Spacecraft Reentry Module Strength Test

Spacecraft Reentry Module Strength Test

Project name: Spacecraft Reentry Module Strength Test

The reentry module of the Shenzhou-7 spacecraft serves as the critical vehicle for astronauts' safe return to Earth after completing space missions. During reentry, the module must withstand extreme conditions including:

    Space environment: Microgravity, vacuum (<10⁻³ Pa), and cryogenic temperatures (-150°C)

    Atmospheric entry: Aerodynamic heating (peak >1600°C) and deceleration loads (>4g)

To validate its structural integrity, our DE-series multi-channel dynamic signal acquisition system and SE-series stress-strain test analysis system were deployed for comprehensive strength evaluation.

spacecraft reentry module strength test

Test Methodology

Multi-Physics Load Simulation

  • Thermal-structural coupling test:
    • 1500°C heat flux + 8 MPa aerodynamic pressure (mimicking peak reentry)

  • Impact test: 10m/s vertical drop (simulating parachute failure contingency)

Instrumentation Configuration

256 measurement channels (full-field coverage)
• High-temperature strain gauges (800°C rated) - 60% of sensors
• Fiber Bragg grating (FBG) sensors - 30% (thermal gradient mapping)
• Piezoelectric accelerometers - 10% (shock measurement)

Sample rate: 50 kHz (capturing microsecond-level transient events)

Key Validation Parameters

  • Structural safety margin ≥1.5 (per CCSDS 880.0-G-1)

  • Ablation layer bonding integrity: Strain discontinuity <0.05%

  • Critical buckling load: 120% of predicted value

Engineering Outcomes

  •   Confirmed 3.2mm carbon-silicon composite heatshield performance

  •   Identified 12% stress concentration at service module interface (later redesigned)

  •   Provided data for GNC algorithm optimization (landing impact reduction by 22%)

  • *(Test protocols compliant with GB/T 28875-2012 space vehicle structural verification standards)*

Conclusion

The spacecraft reentry module strength test successfully verified the Shenzhou-7 module’s ability to withstand extreme thermal, mechanical, and aerodynamic loads encountered during reentry. Utilizing DE-series dynamic acquisition and SE-series stress-strain systems, engineers captured high-fidelity strain, shock, and thermal data, ensuring the module met or exceeded all structural safety margins. The results confirmed heatshield performance, revealed critical stress zones for redesign, and provided essential input for optimizing guidance and landing control, ultimately enhancing astronaut safety and mission reliability.

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